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Overview


The Interconnect Focus Center (IFC) conducts research to discover and invent new electrical, optical and thermal interconnect solutions that will meet or exceed ITRS projections and enable hyper-integration of heterogeneous components for future terascale systems.

The IFC was founded in 1998 to research all aspects of the wiring that connect the millions of transistors on a microchip, from process to system-level architecture. Today and in the future, the microelectronics and nanotechnology industries will lead the evolution of technology in industries from automotive to medical, and from computing to aviation. The IFC strives to stay atop all advances in these fields and play a major role in driving this technology into the future. To that end, the center's research themes have evolved to accommodate this goal.

Research Focus


Exacerbating factors pertaining to the copper-based interconnect schemes for use in future sub-50 nanometer generations of silicon technology drive the need to invent new interconnect solutions. The research focus in the IFC is to discover and invent electrical, optical and thermal interconnect solutions that enable hyper-integration of heterogeneous components. The approach is to capitalize on the enormous amount of research being conducted in nanoscience and technology to develop novel high conductance electrical interconnects to replace copper. Our research also identifies and explores the opportunities and barriers for optical interconnects that will scale to meet the needs of future gigascale silicon electronic systems with emphasis on input/output and global on-chip interconnects.

Interconnect-driven circuit and system design, and modeling are investigated to understand the fundamental trade-offs between electrical and optical interconnections for short-haul communication. In view of the foreseen technology roadblocks of power delivery and thermal management, novel approaches in these areas will be explored.

Themes and Theme Drivers


Research in Interconnect addresses the following four Themes:

I.

Electrical Interconnects
II.
Optical Interconnects

III.

Thermal Management and Power Delivery
IV.
Circuit and System Design and Modeling

The center is also pursuing two Design Drivers:

I.

Futuristic high performance, hypothetical, network routing/computing chip which stresses interconnects to the extreme
II.
Consists of integrated nano-scale non-metallic conductors and devices built on a CMOS platform.

2012 IFC Webinars
Thursdays • 4–5PM Eastern Time

Date

Presenter(s)

Affiliation

19-Jan

Charles Sullivan

Dartmouth

26-Jan

Ju Hyang Nam
Donguk Nam

Stanford

09-Feb

Andrei Fedorov

GA Tech

16-Feb

Connie Chang-Hasnain

UC Berkeley

29-Mar

Robert Geer

Albany

19-Apr

Sailbal Mukhopadhyay
Sudhakar Yalamanchili

GA Tech
GA Tech

26-Apr

Dina Katabi

MIT

03-May

Li-Shiuan Peh

Princeton

10-May

Yogendra Joshi

GA Tech

17-May

Luca Daniel

MIT

31-May

Saroj Nayak

Rensselaer

07-Jun

David Miller

Stanford

14-Jun

Michael Liehr

Albany

28-Jun

Duane Boning

MIT

12-Jul

Ji Ung Lee

Albany

19-Jul

David Perreault

MIT

26-Jul

Michael Filler

GT

02-Aug

Dana Weinstein

MIT

09-Aug

Jing Kong

MIT

16-Aug

Eric Eisenbraun

Albany

23-Aug

Paul Kohl

GT

06-Sep

Vladimir Stojanovic

MIT

13-Sep

Vincent LaBella

Albany

 

 

 

 
Interconnect Focus Center   ::   791 Atlantic Drive, Atlanta, Georgia 30332
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